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Brand Name : SIERRA WIRELESS
Model Number : MC7350
Certification : CE, FCC,ROHS etc
Place of Origin : China,
MOQ : Negotiation1pcs
Price : Negotiable32.5$/pcs-35$/pcs
Payment Terms : T/T, Western Union
Supply Ability : 100000pcs/month
Delivery Time : 5-7 working days
package : MINI PCIE
Band number : B13,B17,B5,B4,B25,B2
Chip : MDM9615
provide : LED driver output
Feature : Wireless
Type : Sierra
Sierra wireless 4G LTE CAT-6 module MC7350 end of life B13,B17,B5,B4,B25,B2 module
Supported RF Bands
 The MC7350 is based on Qualcomm’s MDM9615 baseband processor.
 The following table enumerates the bands and technologies supported by the MC7350 module.
 Table 1. Supported RF Bands
| Band/Connectivity | Data Rates | Notes | 
| CDMA BC0 (Cellular 800 MHz) | CDMA IS-2000 | 3G diversity support | 
| Up to 153 kbps, simultaneous forward and reverse channel | ||
| CDMA BC1(PCS 1900 MHz) | CDMA IS-856 (1xEV-DO Release A) | |
| · Up to 3.1 Mbps forward channel | ||
| CDMA BC10(Secondary 800 MHz) | · Up to 1.8 Mbps reverse channel | |
| Circuit-switched data bearers up to 14.4 kbps | ||
| LTE Band 4 (AWS 1700/2100 MHz) | HSPA+ rates | MIMO support | 
| · Downlink: Up to 42 Mbps (category 24) | ||
| LTE Band 13 (700 MHz) | · Uplink: Up to 5.76 Mbps (category 7) | MIMO support | 
| Circuit-switched data bearers up to 64 kbps | ||
| LTE Band 25 (1900 MHz G Block) | Category 3 | MIMO support | 
| Downlink: | ||
| · 100 Mbps (20 MHz bandwidth) | ||
| · 50 Mbps (10 MHz bandwidth) | ||
| Uplink: | ||
| · 50 Mbps (20 MHz bandwidth) | ||
| · 25 Mbps (10 MHz bandwidth) | 
 1.2. Physical Features
  Small form factor – conforms to type F2 as specified in document [11] PCI Express Mini Card
 Electromechanical Specification Revision 1.2
  Operating temperature range:
  Class A (3GPP compliant): -30°C to +70°C
  Class B (operational, non-3GPP compliant): -40°C to +85°C
 4114103 Rev 4.0 December 03, 2014 12
 Product Technical Specification &
 Customer Design Guidelines Introduction
 Note: The internal module temperature must be kept below 100°C. For best performance, the internal
 module temperature should be kept below 85°C. Proper mounting, heat sinks and active cooling
 may be required, depending on the integrated application.
 1.3. Application Interface Features
  USB interface (QMI) for Windows 7 and legacy Windows operating systems
  MBIM for Windows 8
  USB Link Power Management (LPM2) combined with selective suspend to maximize power
 savings. Also supports fast wakeup.
  AT command interface (refer to document [5] AT Command Set for User Equipment (UE)
 (Release 6), 3GPP TS 27.007, plus proprietary extended AT commands in document [2]
 AirPrime MiniCard MC73xx/MC8805 AT Command Reference)
  Software Development Kits (SDK) for Windows 7 and Windows 8
  Linux SDK, including a Linux API (Application Program Interface)
  QDL loader compliant
  Support for active antenna control via dedicated antenna control signals (ANT_CTRL0:2)
  Dynamic power reduction support via software and dedicated signal (DPR)
 Note: Dial-up networking (DUN) is not supported.
 1.4. Modem Features
  CDMA (EVDO) / LTE operation
  Multiple (up to 16) cellular packet data profiles
  Traditional modem COM port support for AT commands
  USB suspend / resume
  Sleep mode for minimum idle power draw
  SIM application tool kit with proactive SIM commands
  Enhanced Operator Name String (EONS)
  MS-initiated and network-initiated detach
  Mobile-originated PDP context activation / deactivation
  Support QoS profile
  Release 99 QoS negotiation – Background, Interactive, and Streaming
  Release 97 – Precedence Class, Reliability Class, Delay Class, Peak Throughput, Mean
 Throughput
  Static and Dynamic IP address. The network may assign a fixed IP address or dynamically
 assign one using DHCP (Dynamic Host Configuration Protocol).
  PAP and CHAP support
  PDP context type (IPv4, IPv6, or IPv4v6). IP Packet Data Protocol context.
  RFC1144 TCP/IP header compression

ABOUT US
TOP offers communication antennas & modules with wonderful solution, Perfect after-sales service, strict quality testing and competitive price.module brands includes Sierra Wiressless, Simcom, Cinterion, U-blox, Hua wei , ZTE, Holux, Globalsat, GlobaTop, Skylab, Telit, etc.
We're also one of the biggest stocking distributors of active and passive electronic components located in Shenzhen.
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